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Metalized Ceramics
for Soldering of Electronic Elements and Circuits

金屬化陶瓷–用于高溫釬焊
Metalization of Ceramics for Brazing

項(xiàng)目 Items	單位 Unit	用于高溫釬焊 for High-temp Brazing
作業(yè)溫度 Operation Temperature	°C	700-1000
抗拉強(qiáng)度 Pull-Withstanding	MPa	>=60
氣密性(漏氣率) Gas-Tightness (Leak Rate)	Pa·M3/s	<= 10-8
潤(rùn)濕性 wettability		>95% (for AgCu28 Alloy)